EDAPS 2022 Mini-Workshop

The 1st International IEEE EDAPS Mini-Workshop on

Emerging Trends in Semiconductor IC Packaging

Supported by IEEE EPS in collaboration with ELECOM 2022

22nd  November 2022, 2.00-5.00pm, GMT+4

Republic of Mauritius

 

Join Zoom Meeting
https://zoom.us/j/94181506005?pwd=b1NobDRzWU0wSU0yNGlLdTkvdThUdz09


IEEE EDAPS (Electrical Design of Advanced Packaging and Systems) is pleased to announce its 1st International Mini-Workshop on Emerging Trends in Semiconductor Integrated Circuit (IC) Packaging. The IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) symposium has consistently served as a platform for disseminating the latest research on chip, package, and system electrical design. Designers and researchers worldwide share and discuss their work on all aspects of electrical IC packaging, including modeling, design and simulation, fabrication, and characterization. We are excited to host this workshop in IEEE Region 8. This workshop will consist of four invited keynote presentations covering multiple aspects of IC Packaging from experts in academia and industry and invited presentations from EPS Student Chapters/Chapters in Region 8. Your attendance at this event is highly encouraged as it is a forerunner to the highly anticipated EDAPS 2023 Workshop!

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Dr. R. Murugan,

Texas Instruments, Inc., USA

 

Dr. M. Gooroochurn,

University of Mauritius, Republic of Mauritius

 

Assoc Prof (Dr) T.P. Fowdur,

University of Mauritius, Republic of Mauritius

 

Assoc Prof (Dr) R.T.F. Ah King,

University of Mauritius, Republic of Mauritius

 

Prof. M. Swaminathan,

Georgia Tech., USA

 

Prof. J. Schutt-Aine,

University of Illinois, USA

1. Semiconductor IC Packaging, Professor Madhavan Swaminathan

John Pippin Chair in Microsystems Packaging & Electromagnetics, Director, 3D Systems Packaging Research Center (PRC), Georgia Tech (GT), USA

 

2. IC Packaging Trends & Challenges, Professor Paul Franzon

Cirrus Logic Distinguished Professor; Director of Graduate Programs, North CarolinaState University (NCSA), USA

 

3. Trends & Challenges in IC Packaging Manufacturing, Dr. Tanja Braun

Group Leader, Fraunhofer Institute for Reliability and Microintegration, Berlin, Germany

 

4. Modeling for Semiconductor Packaging and Systems , Dr. Hubert Harrer

Senior Technical Staff Member (STSM), IBM Deutschland Research & Development GmbH,

1. Africa, Ethiopia: Prof. F. Mulugeta (AAiT)

2. Europe, United Kingdom: Prof. Chris Bailey, EPS Chapter Chair

3. Middle East, Israel: Aviv Ronen, EPS Chapter Chair

 

Anyone paying a full conference registration for 2 days or a one day registration for the 22nd Nov 2022, will be by default given access to the workshop (if s/he wants to attend). Attendees of the workshop will be required to sign an attendance sheet before the start of the workshop for record purposes in connection with issuing certificate of attendance.

The registration link is below:

https://www.elecom2022.com/registration