ELECOM 2022
22-24 Nov 2022 - Mauritius
The 4th IEEE International Conference on
Emerging Trends in Electrical, Electronic and Communications Engineering
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The 1st International IEEE EDAPS Mini-Workshop on
Emerging Trends in Semiconductor IC Packaging
Supported by IEEE EPS in collaboration with ELECOM 2022
22nd November 2022, 2.00-5.00pm, GMT+4
Republic of Mauritius
Join Zoom Meeting
https://zoom.us/j/94181506005?pwd=b1NobDRzWU0wSU0yNGlLdTkvdThUdz09
IEEE EDAPS (Electrical Design of Advanced Packaging and Systems) is pleased to announce its 1st International Mini-Workshop on Emerging Trends in Semiconductor Integrated Circuit (IC) Packaging. The IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) symposium has consistently served as a platform for disseminating the latest research on chip, package, and system electrical design. Designers and researchers worldwide share and discuss their work on all aspects of electrical IC packaging, including modeling, design and simulation, fabrication, and characterization. We are excited to host this workshop in IEEE Region 8. This workshop will consist of four invited keynote presentations covering multiple aspects of IC Packaging from experts in academia and industry and invited presentations from EPS Student Chapters/Chapters in Region 8. Your attendance at this event is highly encouraged as it is a forerunner to the highly anticipated EDAPS 2023 Workshop!
Dr. R. Murugan,
Texas Instruments, Inc., USA
Dr. M. Gooroochurn,
University of Mauritius, Republic of Mauritius
Assoc Prof (Dr) T.P. Fowdur,
University of Mauritius, Republic of Mauritius
Assoc Prof (Dr) R.T.F. Ah King,
University of Mauritius, Republic of Mauritius
Prof. M. Swaminathan,
Georgia Tech., USA
Prof. J. Schutt-Aine,
University of Illinois, USA
1. Semiconductor IC Packaging, Professor Madhavan Swaminathan
John Pippin Chair in Microsystems Packaging & Electromagnetics, Director, 3D Systems Packaging Research Center (PRC), Georgia Tech (GT), USA
2. IC Packaging Trends & Challenges, Professor Paul Franzon
Cirrus Logic Distinguished Professor; Director of Graduate Programs, North CarolinaState University (NCSA), USA
3. Trends & Challenges in IC Packaging Manufacturing, Dr. Tanja Braun
Group Leader, Fraunhofer Institute for Reliability and Microintegration, Berlin, Germany
4. Modeling for Semiconductor Packaging and Systems , Dr. Hubert Harrer
Senior Technical Staff Member (STSM), IBM Deutschland Research & Development GmbH,
Anyone paying a full conference registration for 2 days or a one day registration for the 22nd Nov 2022, will be by default given access to the workshop (if s/he wants to attend). Attendees of the workshop will be required to sign an attendance sheet before the start of the workshop for record purposes in connection with issuing certificate of attendance.
The registration link is below: